Solder Bumping - A Flexible Joining Approach for the Precision Assembly of Optoelectronical Systems
نویسندگان
چکیده
For microoptics and microsystem assembly, solder bumping is introduced as a flexible and high precise joining alternative to adhesive bonding, especially if adhesives limit the system performance in terms of long term, high temperature, vacuum or UV stability. The bumping technology, which is based on jetting the liquid solder onto wetting surfaces, can be parameter optimised to work in complex environments as well as with submicron accuracy.
منابع مشابه
Precisely Assembled Multi Deflection Arrays - Key Components for Multi Shaped Beam Lithography
Multi shaped beam lithography requires the precise and durable alignment and fixation of MEMS based Multi Deflection Arrays on stable ceramic system platforms using vacuum and high temperature compatible interconnection and joining technologies. Micron accuracy during assembly is accomplished by mark detection using image processing and 3DOF alignment procedures; while interconnection as well a...
متن کاملUncertainty in Manufacture and Assembly of Multiple-Joint Solder Self-Assembled Microelectromechanical Systems (MEMS)
Surface-micromachined microelectromechanical systems (MEMS) are two dimensional in their “as fabricated” form. Surface-micromachined MEMS can be assembled after fabrication to realize systems with a more three-dimensional form and function. One reliable method of assembly, suited to commercial mass production, is to use the surface tension of microsized droplets of molten solder to assemble the...
متن کاملManufacturing & Reliability Data for Lead Free Flip Chip Solder Bumping based on IBM’s C4NP process
High-end microelectronic packaging is increasingly moving from wire bonds to solder bumps as the method of interconnection. There are various solder bumping technologies used in volume production. These include electroplating, solder paste printing, evaporation and the direct attach of preformed solder spheres. Flip chip in Package (FCiP) requires many small bumps on tight pitch whereas Wafer L...
متن کاملStacked solder bumping technology for improved solder joint reliability
Reliability in flip chip and Ball Grid Array is a major concern. Solder joint geometry is extremely important from a reliability point of view. Commonly, the flip chip solder bump takes on the shape of a spherical segment. Mathematical calculations and finite element modeling have shown that the hourglass-shaped solder bumps experience the lowest plastic strain and have the longest lifetime. In...
متن کامل3-d Analysis of a Copper Flip-chip Interconnection Using Fib-sem Slice and View
Recently, flip-chip assembly has become mainstream for fine-pitch interconnection in large-scale integration packages. Gold studs and copper pillars with solder caps are two types of bumps in common use.[1] Gold stud bumps are commonly used for interconnecting dice with peripheral layouts. Gold-gold bonding has the advantage of a low process temperature, and gold-solder with adhesive has good w...
متن کامل